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Overview

The VVDN IQ6 (QCS-615) Industrial Gateway is a high-performance edge computing platform designed, developed, and manufactured by VVDN Technologies for intelligent embedded applications. Powered by the Qualcomm Dragonwing™ IQ-615 processor, it delivers low-latency, power-efficient AI inferencing along with high-speed data processing at the network edge.

Designed for industrial automation, smart factories, robotics, machine vision, smart mobility, and healthcare applications, the gateway supports real-time, mission-critical operations with robust security, rich multimedia capabilities, and seamless connectivity.

Built on a SoM + carrier board architecture, the platform offers design flexibility and rapid product development using a Yocto Linux BSP, along with easy integration with industry-standard frameworks. AI acceleration through the Qualcomm® AI Engine and Qualcomm(R) Hexagon(TM) DSP enables on-device intelligence, reduces cloud dependency, and ensures high-performance edge AI processing.

Key Features:

  • Powered by Qualcomm Dragonwing(TM) IQ-615 processor
  • Advanced AI and Machine Vision Enabled with Qualcomm AI Engine and Hexagon DSP Acceleration
  • SMARC™ 2.2 Standard Pinout
  • Rich High-Speed & Industrial Interfaces
  • Fanless & Robust Design for High-Temperature Environments
  • Optimized for Low Power & Cost Efficiency

Technical Specifications

TYPE DESCRIPTION
Chipset Qualcomm® Dragonwing™ IQ-615
Processor Qualcomm Kryo™ 460 CPU, 64-bit Octa-core Processor
Architecture ARM-based SoC
Graphics Qualcomm Adreno™ 612 GPU @ 845 MHz
Image Processor Qualcomm Spectra™ 230 ISP
AI Acceleration Qualcomm AI Engine with Hexagon DSP, up to 1.1 TOPS
Memory Up to 8 GB LPDDR4x SDRAM
Storage UFS 2.1 up to 128 GB, eMMC 5.1 up to 64 GB (optional), 1 × microSD slot
High Speed Interfaces
  • USB 3.1 Type-A Port x 1
  • USB 2.0 Type-A Port x 1
  • Ethernet LAN (1000M/100M/10M) x 1
Low Speed Interfaces
  • RS232 x 1
  • RS485 x 1
  • CAN 2.0 x 2
  • Wired HART x 1
Display Interface HDMI 1.4b x 1
Wireless Connectivity Bluetooth: 5.3
Wi-Fi: IEEE 802.11a/b/g/n/ac/ax
Expansion Slot
  • 1 × M.2 (USB 3.1 Gen1) for 4G/5G cellular module (supports 450 MHz band)
  • 1 × M.2 (PCIe) for SSD (optional)
  • 1 × M.2 slot for LoRa interface
Security Device
  • Secure Boot, Secure Debug, TrustZone®, Qualcomm Trusted Execution Environment (TEE), Hardware-backed KeyStore, HDCP 1.4/2.2, Secure I²C/SPI, AVB 2.0
  • Crypto Engine v5 (AES, SHA), DRBG/PRNG (FIPS-certified), Inline Crypto Engine (ICE), TRNG
  • Secure File System, Secure Display, eFuse Read/Write, RPMB, Crypto Library
OS Yocto Linux BSP
Ubuntu Linux (on request)
Power Input Input Power Source as 12 VDC, 5 A Max
Enclosure Dimension: 185 x 160 x 44.45 mm
Material: Sheet Metal Case

Use Cases

factory automation
Industrial Automation
& Smart Factories
Robotics
Robotics
Machine Vision
Machine Vision
& Imaging System
Smart Mobility
Smart Mobility
Edge AI
Medical
& Healthcare

Have questions? Speak with our experts to get answers to all your inquiries

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